Surface Profile Transfer Using Light Leaked from Cylindrical Surface of Glass Fiber

Light-assisted etching is a processing method that enables selective by light illumination onto semiconductors in an etchant. In this study, we propose the cylindrical surface forming technique light-assisting using leaking from glass fibers. When propagating fiber was placed contact with semiconductor wafer, wafer vicinity of area exposed. addition, immersing contacted etchant, only exposed expected. A GaAs and immersed nitric acid. Laser wavelength 445 nm entered edge face. The profiles were transferred to after fiber. profile curvature radius ∼50 μm depth 0.3∼1.2 formed 5-minute exposure. By utilizing various different diameter, formed. difference less than 10%.